Simulation, Verification, and Failure Analysis of Fast Recovery Diodes for the Surge Current Capability

The surge performance of Fast Recovery Diodes (FRDs) is a critical factor in power electronics packaging. This study investigates the impact of top interconnection packaging methods on FRDs through both simulation and experimental approaches. The simulation process integrates multi-domain and multi-physics modeling, utilizing Technology Computer-Aided Design (TCAD), Finite Element Method (FEM), and SPICE (Simulation Program with Integrated Circuit Emphasis) tools. An accurate TCAD model for the FRD was developed, with static and dynamic parameters meticulously calibrated. Additionally, an equivalent circuit model for the bonding wire was established. Building on this foundation, a coupled electro-thermal-mechanical model was developed using COMSOL Multiphysics analysis on the finite element method to calculate the influence of bonding wires on the instantaneous temperature rise within the FRDs lattice during surge events. Furthermore, this study explores the effects of alternative top interconnection methods on the surge capability of FRDs.