Embedded Backside Cooling Solution for Two Stacked High-Power Chips

To continue scaling computer system performance, the semiconductor industry is exploring 3D IC to achieve high performance gains through increased IC integration density. 3D IC has the potential to enable the increased system performance through close integration and increased bandwidth of heterogeneous system components such as processor cores, accelerators and high-density memory. However, stacking 2 high-performance and high-power dissipation chips requires new cooling solutions to address associated thermal challenges. To meet the industry unmet needs for new thermal management strategy, we develop a new disruptive embedded backside liquid cooling solution specifically for two stacked high -power chips for future HPC and AI applications.