III-V Laser Diode Flip Chip Bonding on Photonics Integrated Circuit with AgSn Solder
Heterogeneous integration is an efficiency way to integrate III-V laser diode on the silicon-based photonics integration circuit. To provide the III-V laser diode flip-chip bonding solution with cost-efficiency processes and laser diode integration location freedom feature, the cost-efficiency AgSn solder is used and the cavity-based laser diode mounting structure is developed on the photonics integration circuit (PIC). After laser flip-chip bonding, the III-V laser diode is turned on successfully and preliminary reliability is verified. The electric connection line power delivering efficiency is around 90 %.
Authors
- Chong Ser Choong
- Xiaojun Yuan (ORCID: https://orcid.org/0000-0002-0433-6535)
- Wen Lee
- Chi Ting Ta
Institutions
- Agency for Science, Technology and Research (SG)
- Institute of Microelectronics (SG)
- Biotronik (Singapore) (SG)
Publication Details
- Published
- 2024-12-03
- DOI
- https://doi.org/10.1109/eptc62800.2024.10909818
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00