Effect of Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive
The effect of size-controlled Low-Melting-Point-Alloy (LMPA) particles on the reliability of transient liquid phase epoxy conductive adhesive (TLP-ECA) is discussed. The effects of LMPA particles on resistivity and shear strength were evaluated by high temperature aging (120°C, 1000 h) and high temperature and humidity (85°C, 85%RH, 1000 h) tests. Compared with the traditional Ag-ECA, the resistance of TLP-ECA decreases after high temperature aging, and the shear strength decreases with time, but the overall reliability is better. SEM and TEM analysis revealed that LMPA particles formed a metallurgical bridge with Ag sheets during the curing process, which inhibited crack formation and extension, and increases the contact area with the substrate. This ultimately improves the mechanical integrity, resulting in better electrical, mechanical and thermal stability of TLP-ECA.
Authors
- Yongjun Huo (ORCID: https://orcid.org/0000-0001-6367-0501)
- Xiaochen Xie
- Xiuchen Zhao
- Mingkun Yang (ORCID: https://orcid.org/0000-0002-9210-4098)
- Zhibo Qu
- Gang Zhang (ORCID: https://orcid.org/0000-0001-9812-8106)
- Yong Wang (ORCID: https://orcid.org/0000-0002-0545-5851)
- Cheng Wan (ORCID: https://orcid.org/0000-0001-8050-9031)
- Pengrong Lin
- Shimeng Xu
- Zhiteng Wang
- Liang Chen (ORCID: https://orcid.org/0009-0005-2899-8997)
Institutions
- Beijing Institute of Technology (CN)
- Beijing Microelectronics Technology Institute (CN)
- Tsinghua University (CN)
Publication Details
- Published
- 2024-12-03
- DOI
- https://doi.org/10.1109/eptc62800.2024.10909972
- Citations
- 1
- Primary Topic
- Synthesis and properties of polymers
- Type
- article
- Field-Weighted Citation Impact
- 0.17
Funders
- National Natural Science Foundation of China
- Beijing Nova Program