Silicon-Based Micro-Fluid Cooler Package Integration for High Performance Computing

With increasing power and power density, the high-performance-computing (HPC) processors also bring higher and higher heat into the packages and devices. Effective cooling solution is urgently required driven by dramatically increasing power and highly integration. Si-based micro-fluid cooling solution of its unique features has been extensively pursued to address thermal challenge for advanced packages. The integration of Si micro-fluid cooler into high performance processor package has been investigated through simulation and experiment. Thermal performance has been evaluated under both uniform heating and core heating conditions. The effect of cooler base and interface material has been comprehensively studied and compared. The results and conclusions obtained are expected to aid the micro-fluid cooler design and package integration for high performance applications.