Enhancement of Copper Filling by UV Irradiation on Micro-Via

Atmospheric UV treatment was devised as an environmentally friendly alternative to organic material-free etching. This alternative etching treatment method has the characteristic that it does not require any recovery or waste liquid treatment, which is essential in conventional methods. When ABS resin is irradiated by UV light, chemical bonds are charged, and the hydrophilicity of the surface is enhanced. Become to improve the adhesion strength of metal plating. Additionally, the advantage of the UV irradiation method is that it can achieve the same surface modification effect on complex objects like thorough-hole substrates.

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Publication Details

Published
2024-12-03
DOI
https://doi.org/10.1109/eptc62800.2024.10909961
Primary Topic
3D IC and TSV technologies
Type
article
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article

Enhancement of Copper Filling by UV Irradiation on Micro-Via

Keiichiro Sano, Hideo HONMA, Joo-Hyong Noh, Yasushi UMEDA et al.
4 links
3D IC and TSV technologies
article

Enhancement of Copper Filling by UV Irradiation on Micro-Via

Keiichiro Sano, Hideo HONMA, Joo-Hyong Noh, Yasushi UMEDA, D. O. Yi
article en

Abstract

Atmospheric UV treatment was devised as an environmentally friendly alternative to organic material-free etching. This alternative etching treatment method has the characteristic that it does not require any recovery or waste liquid treatment, which is essential in conventional methods. When ABS resin is irradiated by UV light, chemical bonds are charged, and the hydrophilicity of the surface is enhanced. Become to improve the adhesion strength of metal plating. Additionally, the advantage of the UV irradiation method is that it can achieve the same surface modification effect on complex objects like thorough-hole substrates.

Kanto Gakuin University (JP)
Openalex Percentile: Top 74%
3D IC and TSV technologies
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