Optimization of Aluminum Wire Bonding on Niobium Pad for Cryogenic Packaging
Ongoing advancements in research and technology pertaining to superconductors have led to an increased significance of niobium (Nb). It is the element with the greatest transition temperature since it transitions to the superconducting state at 8.6K. Because of its high ductility, Nb can be used to create finished items by cold deep drawing semi-products [1]. Nb is a body-centered cubic metal. Because of these characteristics, niobium is now a perfect material to use in the creation of super-conducting hollow resonators. In this publication, demonstration of Aluminum (Al) wire bonding optimization on Nb material for the application of Cryogenic Packaging will be shared.
Authors
- Chong Ser Choong
- Norhanani Jaafar
- Hongyu Li (ORCID: https://orcid.org/0000-0002-3564-6069)
Institutions
- Agency for Science, Technology and Research (SG)
- Institute of Microelectronics (SG)
Publication Details
- Published
- 2024-12-03
- DOI
- https://doi.org/10.1109/eptc62800.2024.10909835
- Citations
- 1
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.21
Funders
- National Science Foundation, United Arab Emirates