Optimization of Aluminum Wire Bonding on Niobium Pad for Cryogenic Packaging

Ongoing advancements in research and technology pertaining to superconductors have led to an increased significance of niobium (Nb). It is the element with the greatest transition temperature since it transitions to the superconducting state at 8.6K. Because of its high ductility, Nb can be used to create finished items by cold deep drawing semi-products [1]. Nb is a body-centered cubic metal. Because of these characteristics, niobium is now a perfect material to use in the creation of super-conducting hollow resonators. In this publication, demonstration of Aluminum (Al) wire bonding optimization on Nb material for the application of Cryogenic Packaging will be shared.

Authors

Institutions

Publication Details

Published
2024-12-03
DOI
https://doi.org/10.1109/eptc62800.2024.10909835
Citations
1
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
Field-Weighted Citation Impact
0.21

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Optimization of Aluminum Wire Bonding on Niobium Pad for Cryogenic Packaging

Chong Ser Choong, Norhanani Jaafar, Hongyu Li
1 citations
Electronic Packaging and Soldering Technologies
0.21
article

Optimization of Aluminum Wire Bonding on Niobium Pad for Cryogenic Packaging

Chong Ser Choong, Norhanani Jaafar, Hongyu Li
article en
1 citations

Abstract

Ongoing advancements in research and technology pertaining to superconductors have led to an increased significance of niobium (Nb). It is the element with the greatest transition temperature since it transitions to the superconducting state at 8.6K. Because of its high ductility, Nb can be used to create finished items by cold deep drawing semi-products [1]. Nb is a body-centered cubic metal. Because of these characteristics, niobium is now a perfect material to use in the creation of super-conducting hollow resonators. In this publication, demonstration of Aluminum (Al) wire bonding optimization on Nb material for the application of Cryogenic Packaging will be shared.

Agency for Science, Technology and Research (SG), Institute of Microelectronics (SG)
National Science Foundation, United Arab Emirates
Openalex Percentile: Top 43%
Electronic Packaging and Soldering Technologies
0.21
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.