Advanced Prediction Model for SACQ Solder Reliability Assessment for Automotive Memory Applications

Over the past 130 years, the automotive industry has undergone significant evolution, increasingly being associated with safety applications. The reliability, stability and durability of electronic devices are vital, particularly in adhering to the stringent Automotive Electronics Council (AEC) criteria. Conducting board-level temperature cycling tests is imperative within the automotive industry, as it serves as a pivotal method for assessing the reliability of electronic modules. To ensure the robust fatigue performance of lead-free solder joints, the alloy Tin-Silver-Copper (SAC) with 3% Bismuth and 0.05% Nikel which named SACQ is introduced to survive in extreme harsh environments. Prior research has shown that SACQ solder alloys has a significant advantage in terms of temperature cycling performance [1]–[2]. Finite element analysis (FEA) serves as a powerful and essential tool, playing a crucial role in forecasting solder fatigue life. Another hurdle is the accelerated time to market, driven by carmakers' preference for the latest memory package. The qualification process, which includes reliability testing, usually spans several months from design to successful release. To confront the challenges, the framework with shift-left phase involving Finite Element Tool is introduced by assessing reliability performance in early design stage. In this framework, the most important is accurate and effective fatigue life prediction.