A Novel Graphene and Titanium Laminated Composite Film for Electronics Cooling Applications

With the pursuit of electronics product performance, the thermal management of electronics devices is becoming increasingly prominent. It is well-known that graphene film (GF) has very good heat dissipation properties, while metal materials have excellent mechanical properties and anti-aging properties. If they are prepared into laminated materials, which can be used as the shell of heat pipes, vapor chambers and other heat dissipation devices to improve heat dissipation capacity. In this study, we developed a set of new GF/metal laminates and fabricated a new type of lightweight and high thermal conductivity GF/Ti laminated material with an out-plane thermal conductivity of 8.64 Wm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup>K<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup>.

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Publication Details

Published
2024-12-03
DOI
https://doi.org/10.1109/eptc62800.2024.10909904
Primary Topic
Aerogels and thermal insulation
Type
article
Field-Weighted Citation Impact
0.00

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article

A Novel Graphene and Titanium Laminated Composite Film for Electronics Cooling Applications

Lijie He, Jin Chen, Yurui Fang, Xinfeng Wu et al.
Aerogels and thermal insulation
article

A Novel Graphene and Titanium Laminated Composite Film for Electronics Cooling Applications

Lijie He, Jin Chen, Yurui Fang, Xinfeng Wu, Johan Liu, Yuanyuan Wang, Anders Ekholm
article en

Abstract

With the pursuit of electronics product performance, the thermal management of electronics devices is becoming increasingly prominent. It is well-known that graphene film (GF) has very good heat dissipation properties, while metal materials have excellent mechanical properties and anti-aging properties. If they are prepared into laminated materials, which can be used as the shell of heat pipes, vapor chambers and other heat dissipation devices to improve heat dissipation capacity. In this study, we developed a set of new GF/metal laminates and fabricated a new type of lightweight and high thermal conductivity GF/Ti laminated material with an out-plane thermal conductivity of 8.64 Wm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup>K<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup>.

Shanghai Polytechnic University (CN), Smart High Tech (Sweden) (SE), Institute of New Materials (CN), Chalmers University of Technology (SE)
Science and Technology Commission of Shanghai Municipality, Wallenberg Center for Quantum Technology, Chalmers University of Technology
Openalex Percentile: Top 80%
Aerogels and thermal insulation
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