Power Management IC Device Efficiency & Thermal Study

Improving the power efficiency of DC-DC converters on PMICs-Power Management IC is a top priority for Safety and Power Management Devices. Most logical way forward is using a wire bonding_ WB QFN, as long as performance requirements can be met. But sometimes WB QFN package can't meet device efficiency requirement. New approach to improve efficiency: Optimize floor plan and MOSFETs to achieve better symmetry; and die to package codesign for better wire bond layout. So flip chip_ FC QFN is one of suitable candidate package. In this article, we will make some comparation between FC QFN and WB QFN, such as thermal, efficiency, etc. Also including wire length study (with longer or shorter wire length) to check device efficiency impact.