Power Integrity Optimization by DTC for 2.5D CoWoS Package

In this paper, the optimization method of power integrity for high-end 2.5D package is studied by two kinds of capacitor. One is DTC (Deep Trench Capacitor),integrated in silicon substrate and the other is IPD (Integrated Passive Device), mounted on the substrate. It's concluded that DTC works better than IPD in reduction of PDN impedance and maintain power stability. And DTC of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$0.25\mu \mathrm{F}$</tex> can replace IPD of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$1\mu \mathrm{F}$</tex> in this case. The distribution of DTC is also discussed. centralized distribution of DTC is better than corner with 7mV voltage drop improvement.