Material Sensitivity of a Fan-Out Package Warpage - Simulations and Experimental Validation

Warpage is an inevitable processing and quality issue in advanced packaging due to formation of multilayer architecture of thermally dissimilar materials at different processing temperatures. We developed a finite element analysis model to simulate the package warpage and evaluate the sensitivities of dielectric, Cu RDL, and molding compound materials behaviors, their modelling abstractions, especially the effective material properties for RDLs in polymer dielectric layers on the package warpage. Based on these results, we proposed possible ways to minimize the package warpage.