Enhancing Mechanical Robustness and Integrity of a Large Advanced Package with Embedded Fine-Pitch Interconnect Chips

This paper focuses on the co-design via FEA modelling approach in achieving a mechanically robust large package design. Mechanical performance and reliability during BGA reflow and Thermal Cycling on Bord (TCoB) of a large RDL interposer with embedded bridge dies package are evaluated from warpage and solder joint fatigue life perspectives. The key components and factors that could impact or enhance the large EFI (Embedded Fine-pitch Interconnect) interposer package mechanical performance are identified and discussed based on the numerical prediction using Finite Element Analysis (FEA).