Packaging Technology for Sub-Terahertz Antenna in Module

In the sub-terahertz band such as the 150 GHz band, it will be possible to form antennas smaller than 1 mm. It is expected to lead to the miniaturization of RF modules. High processing precision is required to form antennas and transmission lines are required. This report examines some of the challenges that are expected to arise in realizing sub-terahertz antenna modules using organic substrate. A coreless modified semi additive process (MSAP) was employed to achieve an antenna structure with high design flexibility. From some electrical characteristic simulations and actual measurements, the possibility of sub-terahertz Antenna in module (AiM) using organic substrates has been demonstrated.