Polymer Materials for Temporary Bonding and Laser Debonding for MEMS Based Applications: An Evaluation

This study explores the potential of laser debonding technology for high-precision chip packaging applications, offering a flexible and adaptable solution for MEMS device fabrication. The use of UV laser surface ablation allows for precise control over debonding, reducing the risk of mechanical stress damage to device wafers. By tailoring the selection of materials for laser release and adhesive layers and optimizing bonding and debonding processes can be enhanced while minimizing damage and maximizing yield. The laser-induced swell effect, followed by ablation removal, allows for precise control over the debonding process by adjusting laser energy density and overlap rate. The results show that polymer sets with different UV transmittance at 355 nm have varying energy density thresholds for complete decomposition and laser debonding release, with polymer set A requiring 760 mJ/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and polymer set B requiring 950 mJ/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>. The ability to optimize the process window for laser debonding minimizes the risk of mechanical stress damage to the device wafer, making laser debonding technology a suitable solution for high-precision chip packaging applications. The findings highlight the importance of considering critical factors such as adhesive bonding conditions, material compatibility, laser parameters, debonding speed, and post-debonding cleaning to achieve optimal results.