Analysis of Basic Properties and Bonding Properties of Various Melting Temperature Solders
The basic properties and bonding characteristics of SAC305, Sn-Bi, and Sn-Ag-In-Bi solders with different melting points were evaluated. In test results, SAC305 had a melting point of about 217°C, Sn-Bi was about 140°C and Sn-Ag-In-Bi was about 170 to 190°C. These solder showed different ball surface and hardness values based on solder composition. And Sn-Bi solder showed higher ball shear strength than SAC305 and Sn-Ag-In-Bi in Cu-OSP pad finish bonding. But three solder showed almost same ball shear strength in Ni/Au pad finish bonding.
Authors
- B. K. Kim
- T.H. Lee
- Jeong‐Won Park (ORCID: https://orcid.org/0000-0002-2517-8150)
- Lee Jg
- Jeong-Hun Won
- Young-Woo Lee (ORCID: https://orcid.org/0000-0001-5671-7244)
- Han Jo Kim (ORCID: https://orcid.org/0000-0001-7880-690X)
- SG Lee
- Joon-Yul Son
- Jang-Uk Shin
Institutions
- Cisco College (US)
Publication Details
- Published
- 2024-12-03
- DOI
- https://doi.org/10.1109/eptc62800.2024.10909920
- Citations
- 1
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.21