Low Temperature Degradable and Reuse Technology of Semiconductor Liquid Packaging Materials

Underfill encapsulants are mainly used for IC and passive component encapsulation to protect interconnection of chips from environmental damage and provide insulation. Conventional epoxy resin is a resin which is commonly used in encapsulation, and its network structure is not easily degraded which makes the packaged components difficult to be reworked and reused. A novel epoxy resin containing imine linkage was developed. A catalyst degradable binder system with liquid amine and novel epoxy resin were studied, it is shown that the decomposed temperature (Td) of catalyst degradable binder system is as high as to 338.9 °C. The binder system was mixed with silica filler and prepared to liquid encapsulant. The cured encapsulant composition could be degraded under 80 °C by introducing weak base, and silica filler in the composite can be recovered and reused.