Package Miniaturization Through Substrate Design and Assembly Process Optimization - A Product Cost Reduction Case Study

This paper presents a case study of leveraging various package optimization techniques to effectively miniaturize a wirebond BGA package and reduce cost. Furthermore, assembly techniques related to capillary redesign and wirebond process parameter optimizations to accommodate smaller bond pad openings are discussed. The paper also discusses the purpose of having embedded decaps for supply nets in terms of Power integrity (PI) and presents alternate low cost methods to eliminate them.