Investigation on Molding Void Issue in System-in-Package Modules

Plastic encapsulation is a key feature for System-in-Package (SiP) technology as it provides robust mechanical protection and structural support for all the electronic components enclosed within the package. This allows a highly compact design with minimal component-to-component spacing without compromising long-term reliability and performance. However, as the density and complexity of SiP modules continue to escalate, the issue of molding voids and other internal defects is emerging as an increasingly significant concern. In this paper, factors stemming from the encapsulation process that could affect the formation of molding voids and related defects are discussed, and promising solutions to mitigate this issue are also proposed.