The UV Tape with Excellent Adhesion Property for Die to Wafer (D2W) Hybrid Bonding

Die to wafer (D2W) hybrid bonding has become a potential solution for advanced packaging as the interconnect pitch shrinks to less than 1 μm. The dies are attached on the tape, and the tape should present high adhesion and stability property. This paper studies the adhesion and stability of tapes in a variety of chemicals, and theoretically reveals the influence of the composition and structure of tape adhesive layer on the performance. The carboxyl and ester groups on the tape surface contributes to outstanding adhesion of dies on the tape and stability performance in a variety of chemical environments. This research reveals the reasons for the adhesion and stability performance of the tape, which will provide theoretical basis for the selection of die cleaning tape, and support the development of D2W hybrid bonding process and high-density packaging technology.