Wire Sweep Optimization with Mold Process Simulation (Virtual DoE)

Wire sweep is a major concern to molders as the resin flow around the wires could induce potentially high wire deformations, breakage or shorting risks. Several Mold DoE builds are conducted during Package/Tooling Development phases: •Establish molding process window for stable molding •Troubleshooting critical molding issues. •Conventional Trial-and-error experimenting. •Long lead time for sample builds. •Incurring high material/machine/man-hour costs. Molding process simulation is generally utilized to evaluate moldability and identify critical molding issues/defects of package/tool designs and minimize the defect occurrences & intensity. However, molding simulation can also perform virtual DoE analysis legs to assess process variations influence on molded package quality & parametric sensitivity of the package/tooling/wire-bond layout designs. Some earlier studies have shown utility of transfer molding process simulation having good correspondence on wire-sweep prediction and optimization with molding observations [1,2 &3].