Adaptive Pad Stacks Delivering an Order of Magnitude Increase in Bridge Die Position Tolerance in Embedded Fan-out Interposers

Multi-die modules offer a compelling alternative to traditional monolithic ICs, enabling system architects to craft optimized solutions by combining best-in-class chiplets from various manufacturers and technology nodes. This modular approach streamlines the integration of specialized accelerators, memory, and other advanced technologies into a single, high-performance package. Furthermore, multi-die modules improve yield and reduce costs by allowing designers to reuse proven chiplet designs and and test individual components independently. However, ensuring precise alignment and electrical connectivity between chiplets - including bridge die - is crucial during assembly. In this paper, Deca describes the M-Series 3D Embedded Bridge (MEB) and Adaptive Pad Stacks as solutions towards addressing challenges in interconnecting multiple bridge die for advanced chiplet packages.