Fan-Out Packaging Without Warpage

In FOWLP/FOPLP warpage and die shift can still cause issues affecting handling as well as the accuracy of downstream processes. State-of-the-art liquid mold compounds are highly filled to minimize warpage by a very low CTE. As a drawback, this high filler load typically dominates the initial and final material properties, e.g. its flowability or Young's modulus of the cured material. UV-cure enables a fast room-temperature cure that can reduce the dependency on fillers and thus offers more freedom for formulations and design of mechanical profiles for the encapsulation material. Bulk reliability is addressed via adhesion tests after several storage conditions. FEA simulations are carried out to benchmark the property set of a UV cured molding compound against a state-of-the-art heat cured liquid compression mold compound based on model Fan-Out package.