A Method for Die-level Fracture Toughness Evaluation by Nano-Indentation on Ring

This study proposes a method for evaluating fracture toughness of silicon dies in millimeter size using nano-indentation on ring (IOR). Experiments utilizing this method show that it is feasible for such applications. Evaluation on different ring sizes have been performed. The results reveal that the ring size plays an important role in determining the outcome of the tests.