Electrical Design of High-Performance Through Silicon Interposer for RF Transceiver

This paper presents the electrical design methods and results of a high-performance through silicon interposer. The interposer integrates an FPGA, several RF chips, and multiple components, leading to a multi-functional RF transceiver. The design details, including integration schematic, wafer electrical characterization, interconnection design, RF design of transmitter and receiver, signal/power integrity analysis, and measurement, are systematically elaborated.