Metal Thickness Measurement with PULSE<sup>™</sup> Technology for Advanced Packaging Process Control
In this paper, we will discuss PULSE<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">™</sup> technology which has been widely adopted in front-end (FE) interconnect process control. We will show how it can also be used for interconnect process control in advanced packaging (AP).
Authors
- Hwanpil Park
- Dae-Seo Park (ORCID: https://orcid.org/0000-0001-7421-5926)
- R. Mair
- G. A. Antonelli (ORCID: https://orcid.org/0000-0002-8536-2750)
- Cheolkyu Kim (ORCID: https://orcid.org/0000-0002-9915-811X)
- Sanghyun Bae
- Kwansoon Park
- Junghwan Kim (ORCID: https://orcid.org/0000-0003-3017-5330)
- Johnny Dai
- M. Mehendale
Institutions
- Samsung (South Korea) (KR)
- Onto Innovation (United States) (US)
Publication Details
- Published
- 2024-12-03
- DOI
- https://doi.org/10.1109/eptc62800.2024.10909965
- Primary Topic
- Industrial Vision Systems and Defect Detection
- Type
- article
- Field-Weighted Citation Impact
- 0.00