Impact of Die-Attach Voids on the Thermal Performances of Clip-Bonded Packages

In a clip-bonded package, die-attach solder is one of the key contributors to the overall thermal resistance of the package. The presence of solder voids formed between a semiconductor die and the leadframe can have a significant impact on the thermal performance of packaged devices. Any degradation of the heat flow path in the package may result in semiconductor overheating and potentially lead to premature failure of the device. Studies of thermal impact due to die-attach voids are essential for improving device performance and reliability. This paper presents numerical and experimental investigations conducted on clip-bonded MOSFET devices which provide vital information on the effect of solder void pattern on the thermal performance of clip-bonded packages. The data in this study quantitatively assesses the role of voids in package thermal management, and in improving the overall performance of clip-bonded devices.