Engineering a loop thermosyphon with 3D-printed developed microstructured surface of the evaporator

This paper presents the results of development and experiments with a loop thermosyphon with a microstructured heat transfer surface (3D printed) for the case of a flat evaporator and ethanol coolant. The thermal parameters of this device were tested for the temperature in the range from 20 to 128 °C and for the heat flux ranging from 25 to 530 W and for device filling level of 40 ml (100 % of the evaporator volume). It was found that the heat exchanger with pillar-array surface provides the total thermal resistance about 0.18 K/W (corresponding to the top input heat flux equal to 530 W). The developed micropillar array structure for the inner surface of heat exchanger improves the loop thermosyphon efficiency.