Fully printed ultrathin embedded electronics package for wide band gap power semiconductor devices using multimaterial inkjet additive manufacturing

Abstract High-density electronics packaging requires fabrication of intricate conductive and dielectric features within a dense three-dimensional structure. Simultaneous deposition of both conductive and insulative printing materials using multimaterial additive manufacturing (AM) provides new opportunities to fabricate electronics packages with complex designs. This article reports the first demonstration of fully printed power die-embedded electronics package for wide band-gap devices. For this purpose, multimaterial inkjet AM was used to print a 0.5-mm thick electronics package for gallium nitride (GaN) power chips. The conductive parts of the package, including traces and vias, were printed using a high electrical conductivity silver ink, while a polyimide ink was used to print dielectric parts. The electrical characterization tests showed the reasonable performance of the printed package. While the conventional embedded packaging includes many steps such as laminating, plating, and drilling, which creates significant material waste and environmental issues, the proposed AM approach is done in a single step without material waste.