Thermal Engineering of NbO<sub>2</sub>‐Based Memristor for Low‐Power and High‐Capacity Oscillatory Neural Networks

Abstract Negative differential resistance (NDR) devices based on transition metal oxides, such as NbO 2 memristors, inherently exhibit multiple nonlinear dynamics that have garnered considerable interest in emulating neuronal functions. However, the challenge of simultaneously reducing switching voltages and currents while maintaining a stable hysteresis window limits the energy efficiency and computational functionality of NbO 2 ‐based oscillatory systems. Here, a thermal engineering strategy is proposed to break this dilemma, in which a SnSe layer with low thermal conductivity and high electrical conductivity is inserted between the NbO 2 layer and the bottom electrode. This SnSe barrier effectively suppresses thermal dissipation, enabling lower switching voltages and currents in SnSe/NbO 2 devices without compromising their hysteresis window. By using such a thermally optimized device to construct oscillator circuits, a 45% reduction in energy consumption per spike is achieved compared to the NbO y /NbO 2 control sample. Furthermore, the preserved hysteresis window of SnSe/NbO 2 devices enables the construction of oscillatory neural networks (ONNs) with higher oscillator capacity and computational capability than those based on NbO y /NbO 2 devices. These findings shed light on thermal engineering for the development of low‐power NbO 2 ‐based NDR devices, paving the way for energy‐efficient neuromorphic systems and high‐capacity ONNs.

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Publication Details

Journal
Advanced Functional Materials
Published
2025-03-04
DOI
https://doi.org/10.1002/adfm.202423800
Citations
6
Primary Topic
Advanced Memory and Neural Computing
Type
article
Field-Weighted Citation Impact
4.38

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article

Thermal Engineering of NbO2‐Based Memristor for Low‐Power and High‐Capacity Oscillatory Neural Networks

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6 citations
Advanced Functional Materials
Advanced Memory and Neural Computing
4.38
article

Thermal Engineering of NbO2‐Based Memristor for Low‐Power and High‐Capacity Oscillatory Neural Networks

Xianzhe Chen, Jie Qiu, Lingli Cheng, Pei Chen, Ming Liu, Xiaodong Wang, Ming Wang, Qi Liu, Dongzi Yang, Shujing Jia, Yu Li, Xumeng Zhang, Jingyi Chen
article en
6 citations

Abstract

Abstract Negative differential resistance (NDR) devices based on transition metal oxides, such as NbO 2 memristors, inherently exhibit multiple nonlinear dynamics that have garnered considerable interest in emulating neuronal functions. However, the challenge of simultaneously reducing switching voltages and currents while maintaining a stable hysteresis window limits the energy efficiency and computational functionality of NbO 2 ‐based oscillatory systems. Here, a thermal engineering strategy is proposed to break this dilemma, in which a SnSe layer with low thermal conductivity and high electrical conductivity is inserted between the NbO 2 layer and the bottom electrode. This SnSe barrier effectively suppresses thermal dissipation, enabling lower switching voltages and currents in SnSe/NbO 2 devices without compromising their hysteresis window. By using such a thermally optimized device to construct oscillator circuits, a 45% reduction in energy consumption per spike is achieved compared to the NbO y /NbO 2 control sample. Furthermore, the preserved hysteresis window of SnSe/NbO 2 devices enables the construction of oscillatory neural networks (ONNs) with higher oscillator capacity and computational capability than those based on NbO y /NbO 2 devices. These findings shed light on thermal engineering for the development of low‐power NbO 2 ‐based NDR devices, paving the way for energy‐efficient neuromorphic systems and high‐capacity ONNs.

Advanced Functional MaterialsVol. 35(31)
Fudan University (CN), Shanghai Zhangjiang Laboratory (CN), Shanghai Fudan Microelectronics (China) (CN)
National Natural Science Foundation of China, Shanghai Rising-Star Program, National Key Research and Development Program of China
Affordable and clean energy
Openalex Percentile: Top 6%
Advanced Memory and Neural Computing
4.38
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