A type-independent unknown parameters estimation method for lead component

To meet the growing demands in the electronics manufacturing industry for smaller, more reliable, and flexible component packages, this research introduces a novel algorithm designed to automatically measure the geometric parameters of lead components. The algorithm can address the challenges associated with measuring these parameters in surface mount technology (SMT), overcoming the inefficiencies and inaccuracies of traditional manual measurement methods. This innovative approach combines an adaptive threshold segmentation algorithm with a multilevel grayscale range, enabling robust binary segmentation that adapts to variations in illumination. Additionally, by employing conditional filtering and state tracking, the algorithm facilitates the extraction of lead groups and individual leads, allowing for precise evaluation of component parameters through sub-pixel interpolated fitting. Extensive testing under various illumination conditions across multiple types of packaged and standard components has confirmed the algorithm's high accuracy and robustness. These results highlight its efficacy as a measurement solution suitable for industrial-grade applications.