High-efficiency small-pixel-size InGaN green micro-LED arrays using ion implantation pixelization

Micro-LEDs, especially small-size micro-LEDs, have attracted increasing attention for high-resolution displays and high-speed visible light communications in recent years. However, the efficiency of micro-LEDs sharply decreases with decreasing device size due to sidewall damage resulting from the mesa etching. Therefore, the implementation of a low-damage pixelization technique is essential for enhancing the performance of micro-LEDs. In this Letter, ion implantation (IIP) was employed to improve the performance of InGaN green micro-LED arrays with a pixel size of around 6.5 μm and a resolution of 25 × 25. The peak external quantum efficiency of the micro-LED array is enhanced to 6.2%, which is much higher than the 2.4% of that fabricated by conventional inductively coupled plasma etching. In addition, the transmission data rate of the IIP-pixelized micro-LED array is 2.7 times higher, increasing from 115.5 to 307.3 Mbps at an operating current density of about 100 A/cm2. Our work will promote the advancement of high-performance micro-LED applications.

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Publication Details

Journal
Applied Physics Letters
Published
2025-03-01
DOI
https://doi.org/10.1063/5.0248265
Citations
2
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
2.52

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article

High-efficiency small-pixel-size InGaN green micro-LED arrays using ion implantation pixelization

Chaofan Ma, Xinqiang Wang, Pengfei Tian, Ye Yuan et al.
2 citations
Applied Physics Letters
GaN-based semiconductor devices and materials
2.52
article

High-efficiency small-pixel-size InGaN green micro-LED arrays using ion implantation pixelization

Chaofan Ma, Xinqiang Wang, Pengfei Tian, Ye Yuan, Xinyi Shan, Ping Wang, Fang Liu, Yan Wang, Zhaoying Chen, Bo Shen, Z X Yuan, Handan Xu
article en
2 citations

Abstract

Micro-LEDs, especially small-size micro-LEDs, have attracted increasing attention for high-resolution displays and high-speed visible light communications in recent years. However, the efficiency of micro-LEDs sharply decreases with decreasing device size due to sidewall damage resulting from the mesa etching. Therefore, the implementation of a low-damage pixelization technique is essential for enhancing the performance of micro-LEDs. In this Letter, ion implantation (IIP) was employed to improve the performance of InGaN green micro-LED arrays with a pixel size of around 6.5 μm and a resolution of 25 × 25. The peak external quantum efficiency of the micro-LED array is enhanced to 6.2%, which is much higher than the 2.4% of that fabricated by conventional inductively coupled plasma etching. In addition, the transmission data rate of the IIP-pixelized micro-LED array is 2.7 times higher, increasing from 115.5 to 307.3 Mbps at an operating current density of about 100 A/cm2. Our work will promote the advancement of high-performance micro-LED applications.

Applied Physics LettersVol. 126(10)
Peking University (CN), Fudan University (CN), Songshan Lake Materials Laboratory (CN), Collaborative Innovation Center of Quantum Matter (CN)
National Natural Science Foundation of China, National Key Research and Development Program of China
Openalex Percentile: Top 13%
GaN-based semiconductor devices and materials
2.52
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