Design of control system for automated semiconductor etching equipment

In the semiconductor manufacturing process, the etching process is crucial for the accuracy and performance of the device, but the PID (Proportional Integral Derivative) control method has significant shortcomings in control accuracy, reaction rate, and stability, and cannot meet the increasingly stringent requirements of modern chip manufacturing. To solve this problem, this paper designs a control system for automated semiconductor etching equipment. First, this paper builds a multi-parameter real-time monitoring system based on advanced sensor networks and embedded control units to accurately obtain key data during the etching process. Next, an adaptive control algorithm is designed to adjust the etching parameters through feedback control strategy to ensure the stability and accuracy of the etching process. Finally, an expert system based on fuzzy logic is used to optimize the process control to cope with the nonlinear characteristics in complex environments. The experimental results show that the maximum etching error of the adaptive control systemis4 nm, and the average error is 1.7 nm, while the maximum error of the traditional PID control system is 9 nm and the average error is 5.3 nm. In addition, the adaptive control system has a recovery time of 5 seconds when dealing with process disturbances, while the PID control system needs 8 seconds to recover. Compared with traditional PID control systems, adaptive control systems have shown significant advantages in etching accuracy, system stability, and response speed, successfully solving the problem of process fluctuations in the etching process and improving the consistency and process stability of etching depth.