Realizing Intrinsically Ultralow and Glass‐Like Thermal Transport via Chemical Bonding Engineering
Crystals exhibiting glass-like and low lattice thermal conductivity ( <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"> <mml:semantics><mml:msub><mml:mi>κ</mml:mi> <mml:mi>L</mml:mi></mml:msub> <mml:annotation>$\kappa_{\rm L}$</mml:annotation></mml:semantics> </mml:math> ) are not only scientifically intriguing but also practically valuable in various applications, including thermal barrier coatings, thermoelectric energy conversion, and thermal management. However, such unusual <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"> <mml:semantics><mml:msub><mml:mi>κ</mml:mi> <mml:mi>L</mml:mi></mml:msub> <mml:annotation>$\kappa _{\rm L}$</mml:annotation></mml:semantics> </mml:math> are typically observed only in compounds containing heavy elements, with large unit cells, or at high temperatures. In this study, chemical bonding principles are utilized to weaken the Ag-Ag bonds and enhance lattice anharmonicity. The incorporation of a chalcogen anion as a bridge ligand is proposed to facilitate phonon rattling in Ag<sub>6</sub>-octahedron-based compounds. Guided by this design strategy, five Ag<sub>6</sub> octahedron-based compounds, AAg<sub>3</sub>X<sub>2</sub> (A = Li, Na, and K; X = S and Se), which are characterized by low average atomic masses and exhibit exceptionally strong four-phonon scattering, are theoretically identified. Consequently, these compounds demonstrate ultralow thermal conductivities (0.3-0.6 W m<sup>-1</sup> K<sup>-1</sup>) with minimal temperature dependence (T<sup>-0.1</sup>) across a wide temperature range. Experimental validation confirms that the κ<sub>L</sub> of NaAg<sub>3</sub>S<sub>2</sub> is 0.45 W m<sup>-1</sup> K<sup>-1</sup> within the temperature range of 200-550 K. The results clearly demonstrate that weak chemical bonding plays a crucial role in designing compounds with glass-like κ<sub>L</sub>, highlighting the effectiveness of chemical bonding engineering in achieving desired thermal transport properties.
Authors
- Zhonghao Xia (ORCID: https://orcid.org/0000-0002-1202-7521)
- Yi Xia (ORCID: https://orcid.org/0000-0003-3186-308X)
- Yali Yang (ORCID: https://orcid.org/0000-0002-6778-3869)
- Jun Zhou (ORCID: https://orcid.org/0000-0002-6302-0725)
- Jiangang He (ORCID: https://orcid.org/0000-0001-9643-3617)
- Yuling Huang (ORCID: https://orcid.org/0000-0002-1983-270X)
- Xingchen Shen (ORCID: https://orcid.org/0000-0003-1293-1067)
Institutions
- Portland State University (US)
- Centre National de la Recherche Scientifique (FR)
- Northwestern Polytechnical University (CN)
- École Nationale Supérieure d'Ingénieurs de Caen (FR)
- Southern University of Science and Technology (CN)
- University of Science and Technology Beijing (CN)
Publication Details
- Journal
- Advanced Science
- Published
- 2025-03-07
- DOI
- https://doi.org/10.1002/advs.202417292
- Citations
- 11
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 5.70
Funders
- National Science Foundation
- National Natural Science Foundation of China
- H2020 Marie Skłodowska-Curie Actions