Linear Fine-Tuning VFB and Improved Interface via Novel Al₂O₃ Atomic in-situ Dipole Buffer Layer (DBL) in ALD La₂O₃ Dipole-First Stack

In this letter, a novel Al2O3 atomic in-situ dipole buffer layer (DBL) technique is proposed for achieving VFB linear fine-tunability and interface improvement in La2O3 dipole-first gate stack. 10 VFB levels with minimum 9 mV linear fine-tuning step in 400 mV range are achieved by manipulating sub-5-Å Al2O3 between SiO2 interfacial layer (IL) and La2O3 dipole layer in metal-oxide-semiconductor capacitors (MOSCAPs). Furthermore, the Si/SiO2 interface is improved with more than 60.3% interface trap density (Dit) decrease by suppressing La-Si interdiffusion with Al-DBL. A mechanism of La-dipole fine-tuning is proposed and indicates that the Al-DBL is one of the promising techniques for multi-VT integration in future NS GAA-FETs.

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Publication Details

Journal
IEEE Electron Device Letters
Published
2025-03-07
DOI
https://doi.org/10.1109/led.2025.3549003
Citations
3
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
2.19

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article

Linear Fine-Tuning VFB and Improved Interface via Novel Al₂O₃ Atomic in-situ Dipole Buffer Layer (DBL) in ALD La₂O₃ Dipole-First Stack

Yu Wang, Yanzhao Wei, Jianfeng Gao, Huaxiang Yin et al.
3 citations
IEEE Electron Device Letters
Semiconductor materials and devices
2.19
article

Linear Fine-Tuning VFB and Improved Interface via Novel Al₂O₃ Atomic in-situ Dipole Buffer Layer (DBL) in ALD La₂O₃ Dipole-First Stack

Yu Wang, Yanzhao Wei, Jianfeng Gao, Huaxiang Yin, Qingzhu Zhang, Jiaxin Yao, Xiaolei Wang, Jun Luo
article en
3 citations

Abstract

In this letter, a novel Al2O3 atomic in-situ dipole buffer layer (DBL) technique is proposed for achieving VFB linear fine-tunability and interface improvement in La2O3 dipole-first gate stack. 10 VFB levels with minimum 9 mV linear fine-tuning step in 400 mV range are achieved by manipulating sub-5-Å Al2O3 between SiO2 interfacial layer (IL) and La2O3 dipole layer in metal-oxide-semiconductor capacitors (MOSCAPs). Furthermore, the Si/SiO2 interface is improved with more than 60.3% interface trap density (Dit) decrease by suppressing La-Si interdiffusion with Al-DBL. A mechanism of La-dipole fine-tuning is proposed and indicates that the Al-DBL is one of the promising techniques for multi-VT integration in future NS GAA-FETs.

IEEE Electron Device LettersVol. 46(5)
Chinese Academy of Sciences (CN), Institute of Microelectronics (CN)
National Natural Science Foundation of China, Youth Innovation Promotion Association of the Chinese Academy of Sciences
Openalex Percentile: Top 13%
Semiconductor materials and devices
2.19
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