Enhanced <i>di/dt</i>-RC Sensing Structure for Accurate Dynamic Current Measurement in Paralleled SiC MOSFETs

Paralleling SiC <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small>s offers a cost-effective way to increase current capability for high-power applications. However, unbalanced dynamic current sharing among paralleled devices can result in uneven losses and thermal distribution, potentially causing device failure. To monitor or actively balance the currents, a current sensor capable of tracking high-<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">di/dt</i> dynamic currents is required. Existing sensing methods, however, often struggle with poor integration and high cost, while the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">di/dt</i>-<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RC</i> sensing for paralleled devices remains underexplored. This article presents a comprehensive evaluation of <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">di/dt</i>-<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RC</i> sensing for paralleled SiC <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small>s. To enhance the sensing accuracy and mitigate issues generated by circulating current, a novel <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$R_{\mathrm{K}}$</tex-math></inline-formula> sensing structure is proposed in this article. The proposed <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$R_{\mathrm{K}}$</tex-math></inline-formula> sensing structure requires only three passive components (2 resistors and 1 capacitor) per <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small> and can be easily scaled for multiple devices, making it highly advantageous for industrial applications. Circuit-level simulations support the analysis, and experimental results validate that the proposed sensing structure can accurately track dynamic currents under various conditions.

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Journal
IEEE Transactions on Power Electronics
Published
2025-03-07
DOI
https://doi.org/10.1109/tpel.2025.3549039
Citations
3
Primary Topic
Silicon Carbide Semiconductor Technologies
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article
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2.19
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article

Enhanced di/dt-RC Sensing Structure for Accurate Dynamic Current Measurement in Paralleled SiC MOSFETs

Che-Wei Chang, Dong Dong
3 citations
IEEE Transactions on Power Electronics
Silicon Carbide Semiconductor Technologies
2.19
article

Enhanced di/dt-RC Sensing Structure for Accurate Dynamic Current Measurement in Paralleled SiC MOSFETs

Che-Wei Chang, Dong Dong
article en
3 citations

Abstract

Paralleling SiC <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small>s offers a cost-effective way to increase current capability for high-power applications. However, unbalanced dynamic current sharing among paralleled devices can result in uneven losses and thermal distribution, potentially causing device failure. To monitor or actively balance the currents, a current sensor capable of tracking high-<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">di/dt</i> dynamic currents is required. Existing sensing methods, however, often struggle with poor integration and high cost, while the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">di/dt</i>-<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RC</i> sensing for paralleled devices remains underexplored. This article presents a comprehensive evaluation of <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">di/dt</i>-<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RC</i> sensing for paralleled SiC <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small>s. To enhance the sensing accuracy and mitigate issues generated by circulating current, a novel <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$R_{\mathrm{K}}$</tex-math></inline-formula> sensing structure is proposed in this article. The proposed <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$R_{\mathrm{K}}$</tex-math></inline-formula> sensing structure requires only three passive components (2 resistors and 1 capacitor) per <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">mosfet</small> and can be easily scaled for multiple devices, making it highly advantageous for industrial applications. Circuit-level simulations support the analysis, and experimental results validate that the proposed sensing structure can accurately track dynamic currents under various conditions.

IEEE Transactions on Power ElectronicsVol. 40(7)
Virginia Tech (US)
Affordable and clean energy
Openalex Percentile: Top 13%
Silicon Carbide Semiconductor Technologies
2.19
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