Thermal and Hydraulic Collection of using Elliptical Channel with Composite Nanofluid in Electrical Cooling System

With the exception of a sharp rise in power and chip densities and a steady decline in the physical dimensions of thermal management, the electronic field industry's rapid advancements mean that electronic packages remain and will remain the cornerstone of the nearly crucial field in electronic producing development. It would significantly affect performance, overall design, cost and dependability. In the electronic material sector, equipment performance is being increased while equipment size is being reduced. Achieving increased power densities is the goal. One of the best places to use thermal control techniques is in the cooling system of contemporary electronics. The effectiveness of using a nanofluid made of composite materials and pure water for cooling via mini-channel heat sinks was investigated numerically. The novelty and innovation of the present work, represented via numerical analysis, cover the numerical simulation of the new design for an electrical cooling system, which involves a flat coil elliptical channel model for constant base wall temperatures using the ANSYS FLUENT 18 software. This model is based on Reynolds numbers ranging from 1.5 to 6.5 x 104 and temperatures between 330 and 320 K. The employed channels feature an elliptical cross-sectional area, with a radius of 13 mm for big channels and 7 mm for small channels due to the flat coil form. This work introduces a new use of hybrid nanofluid in flat coil channels with an elliptical shape. The channels are machined on copper block bases and have dimensions of 200 mm in width, 50 mm in height and 70 mm in length. For two base temperatures, 40.5 and 47%, respectively, the hybrid nanofluid's heat transfer coefficient is greater than that of pure water. The composite fluid's friction factor is greater than pure water's at all Reynolds numbers, measuring 17.94% and 12.86%, respectively. When compared to the outcomes of pure water, the composite nanofluid's heat transmission ability is observed to be improved. with corresponding standard deviations of 6.4% and 7.8%. The current work's numerical results for the distribution of the friction factor and Nusselt number were verified with values found in the literature and shown satisfactory agreement. The difference between the present numerical results and the experimental Nusselt number from the previous studies was improved by 4.9%, while the present numerical friction factor of composite nanofluid compared with the experimental results obtained from previous studies found an improvement of 46.8% for the present work

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Journal
CFD letters
Published
2025-02-28
DOI
https://doi.org/10.37934/cfdl.17.8.136155
Primary Topic
Heat Transfer and Optimization
Type
article
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article

Thermal and Hydraulic Collection of using Elliptical Channel with Composite Nanofluid in Electrical Cooling System

Kadhim Fadhil Nasir, Haider Al-Hamadani, Rozli Zulkifli, Mahir Faris Abdullah
CFD letters
Heat Transfer and Optimization
article

Thermal and Hydraulic Collection of using Elliptical Channel with Composite Nanofluid in Electrical Cooling System

Kadhim Fadhil Nasir, Haider Al-Hamadani, Rozli Zulkifli, Mahir Faris Abdullah
article en

Abstract

With the exception of a sharp rise in power and chip densities and a steady decline in the physical dimensions of thermal management, the electronic field industry's rapid advancements mean that electronic packages remain and will remain the cornerstone of the nearly crucial field in electronic producing development. It would significantly affect performance, overall design, cost and dependability. In the electronic material sector, equipment performance is being increased while equipment size is being reduced. Achieving increased power densities is the goal. One of the best places to use thermal control techniques is in the cooling system of contemporary electronics. The effectiveness of using a nanofluid made of composite materials and pure water for cooling via mini-channel heat sinks was investigated numerically. The novelty and innovation of the present work, represented via numerical analysis, cover the numerical simulation of the new design for an electrical cooling system, which involves a flat coil elliptical channel model for constant base wall temperatures using the ANSYS FLUENT 18 software. This model is based on Reynolds numbers ranging from 1.5 to 6.5 x 104 and temperatures between 330 and 320 K. The employed channels feature an elliptical cross-sectional area, with a radius of 13 mm for big channels and 7 mm for small channels due to the flat coil form. This work introduces a new use of hybrid nanofluid in flat coil channels with an elliptical shape. The channels are machined on copper block bases and have dimensions of 200 mm in width, 50 mm in height and 70 mm in length. For two base temperatures, 40.5 and 47%, respectively, the hybrid nanofluid's heat transfer coefficient is greater than that of pure water. The composite fluid's friction factor is greater than pure water's at all Reynolds numbers, measuring 17.94% and 12.86%, respectively. When compared to the outcomes of pure water, the composite nanofluid's heat transmission ability is observed to be improved. with corresponding standard deviations of 6.4% and 7.8%. The current work's numerical results for the distribution of the friction factor and Nusselt number were verified with values found in the literature and shown satisfactory agreement. The difference between the present numerical results and the experimental Nusselt number from the previous studies was improved by 4.9%, while the present numerical friction factor of composite nanofluid compared with the experimental results obtained from previous studies found an improvement of 46.8% for the present work

CFD lettersVol. 17(8)
Alrafidain University College (IQ), National University of Malaysia (MY)
Industry, innovation and infrastructure
Openalex Percentile: Top 96%
Heat Transfer and Optimization
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