Evidence for double degradation regime in off-state stressed 100 V GaN transistors: From dielectric failure to subthreshold current increase

We demonstrate the existence of two different degradation mechanisms for 100 V GaN transistors submitted to off-state stress. When the devices are stressed in strong pinch-off conditions, a high electric field falls on the dielectric between the source field plate and the channel, and a time dependent dielectric breakdown is observed. On the other hand, for weaker pinch-off, hot electrons trapping at the passivation surface can lower the electric field, leading to longer TTF. A second degradation mode is also observed, consisting in the gradual increase in off-state current, ascribed to positive charge trapping at defects spots. • Off state behavior analysis on low voltage gallium nitride transistors • Weibull statistic highlights double trend for time to failure. • Different degradation mechanisms observed, depending on the pinch off condition • Electroluminescence measurement evidences the differences between mechanisms.

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Publication Details

Journal
Microelectronics Reliability
Published
2025-03-07
DOI
https://doi.org/10.1016/j.microrel.2025.115649
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
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article

Evidence for double degradation regime in off-state stressed 100 V GaN transistors: From dielectric failure to subthreshold current increase

Enrico Zanoni, E. Canato, Manuel Fregolent, Maria Eloisa Castagna et al.
Microelectronics Reliability
GaN-based semiconductor devices and materials
article

Evidence for double degradation regime in off-state stressed 100 V GaN transistors: From dielectric failure to subthreshold current increase

Enrico Zanoni, E. Canato, Manuel Fregolent, Maria Eloisa Castagna, Alessandro Pirani, Matteo Meneghini, Mirco Boito, Carlo De Santi, Cristina Miccoli, Isabella Rossetto, Riccardo Fraccaroli, Gaudenzio Meneghesso, Giansalvo Pizzo, Ferdinando Iucolano, Alfio Russo
article en

Abstract

We demonstrate the existence of two different degradation mechanisms for 100 V GaN transistors submitted to off-state stress. When the devices are stressed in strong pinch-off conditions, a high electric field falls on the dielectric between the source field plate and the channel, and a time dependent dielectric breakdown is observed. On the other hand, for weaker pinch-off, hot electrons trapping at the passivation surface can lower the electric field, leading to longer TTF. A second degradation mode is also observed, consisting in the gradual increase in off-state current, ascribed to positive charge trapping at defects spots. • Off state behavior analysis on low voltage gallium nitride transistors • Weibull statistic highlights double trend for time to failure. • Different degradation mechanisms observed, depending on the pinch off condition • Electroluminescence measurement evidences the differences between mechanisms.

Microelectronics ReliabilityVol. 168
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GaN-based semiconductor devices and materials
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