Quality concerns caused by quality control — deformation of silicon strip detector modules in thermal cycling tests

Abstract The ATLAS experiment at the Large Hadron Collider (LHC) is currently preparing to replace its present Inner Detector (ID) with the upgraded, all-silicon Inner Tracker (ITk) for its High-Luminosity upgrade (HL-LHC). The ITk will consist of a central pixel tracker and the outer strip tracker, consisting of about 19,000 strip detector modules. Each strip module is assembled from up to two sensors, and up to five flexes (depending on its geometry) in a series of gluing, wirebonding and quality control steps. During detector operation, modules will be cooled down to temperatures of about -35 ∘ C (corresponding to the temperature of the support structures on which they will be mounted) after being initially assembled and stored at room temperature. In order to ensure compatibility with the detector's operating temperature range, modules are subjected to thermal cycling as part of their quality control process. Ten cycles between -35 ∘ C and +40 ∘ C are performed for each module, with full electrical characterisation tests at each high and low temperature point. As part of an investigation into the stress experienced by modules during cooling, it was observed that modules generally showed a change in module shape before and after thermal cycling. This paper presents a summary of the discovery and understanding of the observed changes, connecting them with excess module stress, as well as the resulting modifications to the module thermal cycling procedure.

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Publication Details

Journal
Journal of Instrumentation
Published
2025-03-01
DOI
https://doi.org/10.1088/1748-0221/20/03/p03004
Citations
1
Primary Topic
Particle Detector Development and Performance
Type
article
Field-Weighted Citation Impact
1.87
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article

Quality concerns caused by quality control — deformation of silicon strip detector modules in thermal cycling tests

V. Fadeyev, B. Crick, M. Gignac, C. Lacasta et al.
1 citations
Journal of Instrumentation
Particle Detector Development and Performance
1.87
article

Quality concerns caused by quality control — deformation of silicon strip detector modules in thermal cycling tests

V. Fadeyev, B. Crick, M. Gignac, C. Lacasta, M. Moshe, C. Solaz, Kirsten Affolder, P. Federic, A. A. Affolder, Miao Hu, John Hallford, Vicente Platero, Aaron C. Petersen, P. Speers, Gerrit van Nieuwenhuizen, A. Poley, A. W. Fortman, P. Kumari, E. Hill, Laura Franconi, Cole Michael Helling, Herman A. Lopez, R. Salami, Ian Dyckes, Lukas Bayer, Madison Levagood, Len Morelos-Zaragoza, Lisa Sitnikova, J. Kroll, Archa Devi Rajagopalan, Emily Rose Duden, Shubham Gupta, Alex Zeng Wang
article en
1 citations

Abstract

Abstract The ATLAS experiment at the Large Hadron Collider (LHC) is currently preparing to replace its present Inner Detector (ID) with the upgraded, all-silicon Inner Tracker (ITk) for its High-Luminosity upgrade (HL-LHC). The ITk will consist of a central pixel tracker and the outer strip tracker, consisting of about 19,000 strip detector modules. Each strip module is assembled from up to two sensors, and up to five flexes (depending on its geometry) in a series of gluing, wirebonding and quality control steps. During detector operation, modules will be cooled down to temperatures of about -35 ∘ C (corresponding to the temperature of the support structures on which they will be mounted) after being initially assembled and stored at room temperature. In order to ensure compatibility with the detector's operating temperature range, modules are subjected to thermal cycling as part of their quality control process. Ten cycles between -35 ∘ C and +40 ∘ C are performed for each module, with full electrical characterisation tests at each high and low temperature point. As part of an investigation into the stress experienced by modules during cooling, it was observed that modules generally showed a change in module shape before and after thermal cycling. This paper presents a summary of the discovery and understanding of the observed changes, connecting them with excess module stress, as well as the resulting modifications to the module thermal cycling procedure.

Journal of InstrumentationVol. 20(03)
TRIUMF (CA), Consejo Superior de Investigaciones Científicas (ES), University of British Columbia (CA), Lawrence Berkeley National Laboratory (US), Universitat de València (ES), Simon Fraser University (CA), University of California, Santa Cruz (US), University of Toronto (CA), York University (CA), Brookhaven National Laboratory (US), Charles University (CZ), Deutsches Elektronen-Synchrotron DESY (DE), Brandeis University (US)
Openalex Percentile: Top 15%
Particle Detector Development and Performance
1.87
DOIOpen Access PDFOpenAlex
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