Unintentional Fe incorporation in the homo-epitaxy of GaN on Fe-doped freestanding GaN substrate

Abstract The unintentional Fe incorporation in the homo-epitaxy of GaN on Fe-doped freestanding GaN substrate is harmful to the performance of a high-electron-mobility transistor device, but the incorporation mechanism is unclear. The memory effect, diffusion from the Fe-doped GaN substrate to the epilayer, thermal decomposition on the N-face and Ga-face are all considered to find the origin. The Ga-face thermal decomposition during the heating process before growth is regarded as the main reason responsible for the unintentional Fe doping according to the time-of-flight secondary ions mass spectroscopy measurement results, vapor phase decomposition inductively coupled plasma mass spectrometry, and dynamic secondary ions mass spectroscopy measurement results. Molecular beam epitaxy growth of the GaN epilayer at lower temperatures could effectively suppress the unintentional Fe doping.

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Publication Details

Journal
Applied Physics Express
Published
2025-03-01
DOI
https://doi.org/10.35848/1882-0786/adbc44
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.00

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article

Unintentional Fe incorporation in the homo-epitaxy of GaN on Fe-doped freestanding GaN substrate

JunShuai Xue, Qizhi Zhu, Songyuan Xia, Jianfeng Wang et al.
Applied Physics Express
GaN-based semiconductor devices and materials
article

Unintentional Fe incorporation in the homo-epitaxy of GaN on Fe-doped freestanding GaN substrate

JunShuai Xue, Qizhi Zhu, Songyuan Xia, Jianfeng Wang, Weiping Liu, Ke Xu, Yuanhang Sun, Juemin Yi, Yumin Zhang
article en

Abstract

Abstract The unintentional Fe incorporation in the homo-epitaxy of GaN on Fe-doped freestanding GaN substrate is harmful to the performance of a high-electron-mobility transistor device, but the incorporation mechanism is unclear. The memory effect, diffusion from the Fe-doped GaN substrate to the epilayer, thermal decomposition on the N-face and Ga-face are all considered to find the origin. The Ga-face thermal decomposition during the heating process before growth is regarded as the main reason responsible for the unintentional Fe doping according to the time-of-flight secondary ions mass spectroscopy measurement results, vapor phase decomposition inductively coupled plasma mass spectrometry, and dynamic secondary ions mass spectroscopy measurement results. Molecular beam epitaxy growth of the GaN epilayer at lower temperatures could effectively suppress the unintentional Fe doping.

Applied Physics ExpressVol. 18(3)
Xidian University (CN), Chinese Academy of Sciences (CN), ShanghaiTech University (CN), Suzhou University of Science and Technology (CN), Suzhou Institute of Nano-tech and Nano-bionics (CN)
National Natural Science Foundation of China, National Key Research and Development Program of China
Openalex Percentile: Top 98%
GaN-based semiconductor devices and materials
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Unintentional Fe incorporation in the homo-epitaxy of GaN on Fe-doped freestanding GaN substrate — JunShuai Xue, Qizhi Zhu, et al. · Applied Physics Express (2025) | TGRS Research Map | TGRS