LASER DECAPSULATION OF SMD PRODUCT ENCLOSURES ELECTRONIC COMPONENT BASE

The article describes the work on laser opening (decapsulation) of SMD cases of electronic component products (hereinafter referred to as ECB): quartz oscillators and resonators. Decapsulation of electronic components products is carried out for the purpose of detecting and analyzing defects. The use of the laser method makes it possible to decapsulate several products in a short time using a once-developed program compatible with a precision laser marking system. Research has determined the optimal positioning of a rectangular laser cut, which minimizes the impact of the laser beam on internal components. Work has been carried out to find a method for removing part of the product cover that has been cut off by a laser. An optimal method has been found for removing part of the cover using mechanical processing. During the work, special equipment was designed and manufactured for dismantling part of the housing cover after laser cutting. The equipment provides reliable fastening of SMD cases without the use of additional materials: ethyl cyanoacrylate glue, solder or hot melt adhesive. As a result of the work, conclusions were drawn about the effectiveness of the laser decapsulation method. The cost of its implementation was calculated. The scientific novelty of using the laser decapsulation method lies in the fact that this method was used for the first time in Russia to open piezoelectric products. The non-standard use of the high-tech precision laser marking and engraving system MiniMARKER2tm, widespread on the Russian market since 2004, expands its use for work on analyzing defects of various electronic component products in SMD cases. Also selected are the positioning, shape and laser cutting modes for different sizes of SMD packages, which have not previously been considered by other authors of scientific research.A technology has been developed that allows for precision decapsulation of electronic components without damaging internal components (piezoelectric element and microcircuit). The developed technology for decapsulation using laser cutting is recommended for opening products in SMD cases when analyzing manufacturing defects and carrying out complaint work.