Copper Migration into Epoxy at High Temperature: Its Reason, Effect, and Way to Reduce It

Authors

Shuaijie Zhao (ORCID: https://orcid.org/0000-0002-4549-8952)

Institutions

Fuji Electric (Japan) (JP)

Publication Details

Journal: Journal of The Japan Institute of Electronics Packaging
Published: 2025-02-28
DOI: https://doi.org/10.5104/jiep.28.190
Primary Topic: Copper Interconnects and Reliability
Type: article
Field-Weighted Citation Impact: 0.00

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article

Copper Migration into Epoxy at High Temperature: Its Reason, Effect, and Way to Reduce It

Shuaijie Zhao

Feb 28, 2025

Journal of The Japan Institute of Electronics Packaging

Copper Interconnects and Reliability

article

Copper Migration into Epoxy at High Temperature: Its Reason, Effect, and Way to Reduce It

Shuaijie Zhao

February 28, 2025article en

Abstract

No abstract available for this paper.

Journal of The Japan Institute of Electronics PackagingVol. 28(2)

Fuji Electric (Japan) (JP)

Reduced inequalities

Openalex Percentile: Top 98%

Copper Interconnects and Reliability

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Copper Migration into Epoxy at High Temperature: Its Reason, Effect, and Way to Reduce It — Shuaijie Zhao · Journal of The Japan Institute of Electronics Packaging (2025) | TGRS Research Map | TGRS