Study of Application of an Active Ultrasound by Use of Zn-Al-Mg-Ti-Based Solder on Selected Substrates
This study investigates the potential application of Zn5Al1.5Mg1.5Ti active solder in ultrasonic soldering of Al<sub>2</sub>O<sub>3</sub> ceramics and Cu substrates. The research explores the microstructural characteristics, phase composition, and mechanical properties of the solder and the resulting joints. Particular attention is given to the formation mechanisms of the solder-substrate bond and the role of ultrasound activation in enhancing wettability and bond strength. The study aimed to provide a deeper understanding of active soldering processes and their suitability for high-temperature applications. The findings contribute to advancing lead-free soldering technologies for electronic and structural applications.
Authors
- Peter Gogola (ORCID: https://orcid.org/0000-0001-5046-4725)
- Roman Koleňák (ORCID: https://orcid.org/0000-0003-4981-186X)
- Jaromír Drápala (ORCID: https://orcid.org/0000-0001-9630-5025)
- Tomáš Meluš
- Matej Pašák (ORCID: https://orcid.org/0000-0001-8342-3727)
Institutions
- Slovak University of Technology in Bratislava (SK)
- VSB - Technical University of Ostrava (CZ)
Publication Details
- Journal
- Materials
- Published
- 2025-02-28
- DOI
- https://doi.org/10.3390/ma18051094
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00