Contamination-free assembly of two-dimensional van der Waals heterostructures toward high-performance electronics and optoelectronics

• A novel vdW-transfer technique enables contamination-free assembly of 2D crystal devices. • The vdW-assisted layer is universal, improving device performance across various 2D crystals. • MoS 2 /WSe 2 photodetectors show 5.7-fold responsivity enhancement using vdW-transfer. • WSe 2 -FETs fabricated via vdW-transfer exhibit a 30-fold increase in hole mobility, an order-of-magnitude reduction in hysteresis, and a 4-fold reduction in subthreshold swing. Mechanical exfoliation and transfer of two-dimensional (2D) crystals are usually used to fabricate van der Waals (vdW) heterostructural electronic and optoelectronic devices for fundamental studies. However, the conventional transfer (c-transfer) techniques often involve direct contact between the polymer supports and the 2D crystals, resulting in surface contamination that degrades device performance. Here, we present a novel vdW-transfer technique utilizing a polyvinyl chloride-covered polydimethylsiloxane microdome polymer (MDP) with a vdW-assisted layer, enabling a contamination-free assembling of 2D crystal-based electronic and optoelectronic devices. This vdW-assisted layer prevents direct contact between the polymer and target materials, yielding high-quality interfaces free of interlayer contamination and enhancing device performance. Using this vdW-transfer technique, we fabricate MoS 2 /WSe 2 heterostructure photodetectors and WSe 2 field-effect transistors (FETs). Compared with the photodetector fabricated by the c-transfer technique, the device fabricated by the vdW-transfer method exhibits a significant improvement in the linearity (from 0.61 to 1.01) of photoresponse, a 5.7-fold enhancement in responsivity, and an order-of-magnitude decrease in response time. Additionally, the WSe 2 -FET produced by the vdW-transfer demonstrates nearly a 30-fold increase in hole carrier mobility, an order-of-magnitude reduction in hysteresis, and a 4-fold reduction in subthreshold swing compared with FET fabricated by the c-transfer method. We introduce a universal van der Waals (vdW) transfer technique using a microdome polymer with a vdW-assisted layer, enabling contamination-free assembly of 2D crystal devices. This method significantly enhances device performance, yielding high-quality MoS 2 /WSe 2 photodetectors and WSe 2 field-effect transistors with superior responsivity, mobility, and stability.

Authors

Publication Details

Journal
Applied Materials Today
Published
2025-02-28
DOI
https://doi.org/10.1016/j.apmt.2025.102657
Citations
9
Primary Topic
Graphene research and applications
Type
article
Field-Weighted Citation Impact
4.66

Funders

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article

Contamination-free assembly of two-dimensional van der Waals heterostructures toward high-performance electronics and optoelectronics

Changyong Lan, Shaofeng Wen, Yi Yin, Haohan Chen et al.
9 citations
Applied Materials Today
Graphene research and applications
4.66
article

Contamination-free assembly of two-dimensional van der Waals heterostructures toward high-performance electronics and optoelectronics

Changyong Lan, Shaofeng Wen, Yi Yin, Haohan Chen, Shuren Zhou, Ling Bing Kong, Yong Liu, Chun Li, Yimin Gong
article en
9 citations

Abstract

• A novel vdW-transfer technique enables contamination-free assembly of 2D crystal devices. • The vdW-assisted layer is universal, improving device performance across various 2D crystals. • MoS 2 /WSe 2 photodetectors show 5.7-fold responsivity enhancement using vdW-transfer. • WSe 2 -FETs fabricated via vdW-transfer exhibit a 30-fold increase in hole mobility, an order-of-magnitude reduction in hysteresis, and a 4-fold reduction in subthreshold swing. Mechanical exfoliation and transfer of two-dimensional (2D) crystals are usually used to fabricate van der Waals (vdW) heterostructural electronic and optoelectronic devices for fundamental studies. However, the conventional transfer (c-transfer) techniques often involve direct contact between the polymer supports and the 2D crystals, resulting in surface contamination that degrades device performance. Here, we present a novel vdW-transfer technique utilizing a polyvinyl chloride-covered polydimethylsiloxane microdome polymer (MDP) with a vdW-assisted layer, enabling a contamination-free assembling of 2D crystal-based electronic and optoelectronic devices. This vdW-assisted layer prevents direct contact between the polymer and target materials, yielding high-quality interfaces free of interlayer contamination and enhancing device performance. Using this vdW-transfer technique, we fabricate MoS 2 /WSe 2 heterostructure photodetectors and WSe 2 field-effect transistors (FETs). Compared with the photodetector fabricated by the c-transfer technique, the device fabricated by the vdW-transfer method exhibits a significant improvement in the linearity (from 0.61 to 1.01) of photoresponse, a 5.7-fold enhancement in responsivity, and an order-of-magnitude decrease in response time. Additionally, the WSe 2 -FET produced by the vdW-transfer demonstrates nearly a 30-fold increase in hole carrier mobility, an order-of-magnitude reduction in hysteresis, and a 4-fold reduction in subthreshold swing compared with FET fabricated by the c-transfer method. We introduce a universal van der Waals (vdW) transfer technique using a microdome polymer with a vdW-assisted layer, enabling contamination-free assembly of 2D crystal devices. This method significantly enhances device performance, yielding high-quality MoS 2 /WSe 2 photodetectors and WSe 2 field-effect transistors with superior responsivity, mobility, and stability.

Applied Materials TodayVol. 43
National Natural Science Foundation of China, Natural Science Foundation of Sichuan Province, Sichuan Province Science and Technology Support Program
Openalex Percentile: Top 5%
Graphene research and applications
4.66
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