Research on Filter Transmission Performance Based on Substrate Stacking Process

Aiming at the impedance matching problem when RF transmission lines are cascaded with RF devices and the parasitic effect of bandpass filter chips in the vertical interconnection structure of the substrate, a solution to match the bonding connection between the bandpass lines and the filter chips in the chip stacking process is proposed. An electromagnetic simulation model is developed to analyze the influence of key parameters and copper laying structure on the transmission performance. The optimized chip cascade structure has good VSWR and transmission performance in the operating frequency band, and at the same time brings higher out-of-band suppression, which provides a reference for practical circuit applications.