Anomalous thermal transport in semiconductors induced by aliovalent doping

As an effective method for thermal management technologies, doping or substitution has been extensively utilized to reduce the lattice thermal conductivity of various materials. Intensive studies have been conducted about the phonon mechanism of isoelectronic alloying since the 1950s. Very recently, the specific role of aliovalent doping was elucidated in the half-Heusler NbFeSb system. Here, we have theoretically and experimentally investigated the mechanism of reducing thermal conductivity through aliovalent doping by combining first-principles calculations and neutron diffraction studies for the case study of the TiCoSb half-Heusler system. The softening of the acoustic branches induced by aliovalent doping can effectively reduce the phonon group velocities. Moreover, the introduction of compensating defects, resulting from changes in the Fermi level, plays a vital role in decreasing the relaxation time of phonons, as demonstrated by the analysis of neutron powder diffraction. Due to these two factors, doping with adjacent elements results in a significant reduction in lattice thermal conductivity (for instance, Ni doping at the Co site in the TiCoSb half-Heusler system), especially in the low-temperature range. Our findings provide valuable insight into the phonon scattering mechanism in aliovalent-doped materials and demonstrate the role of compensating defects in heat transport, which is applicable to other doped semiconductor systems.

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Publication Details

Journal
Applied Physics Reviews
Published
2025-02-26
DOI
https://doi.org/10.1063/5.0245759
Citations
9
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
4.66

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article

Anomalous thermal transport in semiconductors induced by aliovalent doping

Weimin Cai, Lei Jiao, Lankun Wang, Mitchell M. Bordelon et al.
9 citations
Applied Physics Reviews
Advanced Thermoelectric Materials and Devices
4.66
article

Anomalous thermal transport in semiconductors induced by aliovalent doping

Weimin Cai, Lei Jiao, Lankun Wang, Mitchell M. Bordelon, Stephen D. Wilson, Jiehe Sui, Jiawei Zhou, Fengkai Guo, Yuke Zhu, Jianbo Zhu, Zihang Liu, B Xia, Xingyan Dong
article en
9 citations

Abstract

As an effective method for thermal management technologies, doping or substitution has been extensively utilized to reduce the lattice thermal conductivity of various materials. Intensive studies have been conducted about the phonon mechanism of isoelectronic alloying since the 1950s. Very recently, the specific role of aliovalent doping was elucidated in the half-Heusler NbFeSb system. Here, we have theoretically and experimentally investigated the mechanism of reducing thermal conductivity through aliovalent doping by combining first-principles calculations and neutron diffraction studies for the case study of the TiCoSb half-Heusler system. The softening of the acoustic branches induced by aliovalent doping can effectively reduce the phonon group velocities. Moreover, the introduction of compensating defects, resulting from changes in the Fermi level, plays a vital role in decreasing the relaxation time of phonons, as demonstrated by the analysis of neutron powder diffraction. Due to these two factors, doping with adjacent elements results in a significant reduction in lattice thermal conductivity (for instance, Ni doping at the Co site in the TiCoSb half-Heusler system), especially in the low-temperature range. Our findings provide valuable insight into the phonon scattering mechanism in aliovalent-doped materials and demonstrate the role of compensating defects in heat transport, which is applicable to other doped semiconductor systems.

Applied Physics ReviewsVol. 12(1)
University of California, Santa Barbara (US), Chinese University of Hong Kong (HK), Harbin Institute of Technology (CN), University of Hong Kong (HK)
National Natural Science Foundation of China, Natural Science Foundation of Heilongjiang Province, Fundamental Research Funds for the Central Universities
Openalex Percentile: Top 5%
Advanced Thermoelectric Materials and Devices
4.66
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