A Material Removal Rate Prediction Model for High-Shear and Low-Pressure Grinding of Single Crystal Silicon

Abstract A novel abrasive tool, based on the principle of liquid body armor, was developed in a previous study. However, a material removal rate (MRR) model for the high-shear and low-pressure grinding of brittle materials using this tool has yet to be established. Through the analysis of the contact mechanism, two critical transition depths and three distinct stages were identified. The acting force on an active abrasive grain and its corresponding depth of cut were also determined. The influence of various grinding parameters on the maximum undeformed chip thickness (MUCT) was analyzed. Subsequently, an MRR prediction model was developed, incorporating the stress distribution at the contact interface. The effectiveness of this model was validated through high-shear and low-pressure grinding experiments. The predicted MRR values under different grinding parameters, such as normal force, grinding speed, and workpiece feed rate, showed a strong correlation with experimental results, with average prediction errors of 12.65%, 10.30%, and 8.70%, respectively.