A Pattern Reconfigurable Microstrip Patch Antenna With Through Glass Via

In this paper, a pattern reconfigurable microstrip patch antenna with through glass via (TGV) by loading parasitic patches is proposed. It consists of a driving microstrip patch antenna and a pair of parasitic patches symmetrically placed on both sides of the driving patch antenna. A PIN diode is loaded on the parasitic patch as a switch by changing the voltage applied to the PIN diode, thus realising three parasitic patch states. The antenna adopts an advanced through glass via (TGV) process, which greatly improves the accuracy and reduces the loss compared with PCB. The centre frequency of the antenna is set at 33 GHz during the simulation. The proposed antenna can be miniaturised with a size of 0.44λ<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0</inf> × 0.44λ<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0</inf> ×0.09λ<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0</inf>, with a bandwidth of 10.8% in the 29.9–33.3 GHz band, and a peak gain of more than 6.1 dBi for all three states. With the merits of low profile, miniaturisation, and advanced TGV techniques, the proposed antenna is suitable for future heterogeneous integration applications.