Development of High Precision Thick Film Process for Realization of Microwave Modules

This paper explores the application of high density gold conductor paste with capability of ultra-fine line etching for microwave frequency applications. By blending thick film technology, photolithography and etching on low-loss dielectric 99.6% Alumina substrate, ultra-fine line patterns with sizes down to 40 μm has been achieved. The study focuses on the fabrication process, detailing the optimization & fine-tuning of printing parameters to achieve high precision and reliability. Further, photolithography is employed to define intricate patterns with fine feature sizes, ensuring minimal signal loss and maintaining the integrity of microwave signals. By implementing this technology, high-performance filters ranging from the C-band to the Ku-band are realized. The performance of the fabricated circuits is evaluated in terms of conductivity, adhesion, and microwave frequency response. The performance of the filters is promising and demonstrate that this technology offers performance comparable to that of Thin Film technology. Results indicate that the combination of ultra-fine line conductor paste with advanced printing and photolithography techniques on alumina substrate offers a viable solution for microwave components, providing enhanced signal fidelity and potential miniaturization. This approach paves the way for advancements in microwave communication systems, sensor technologies, and other high-frequency applications.