Effects of the RF bias power of ICP etching on the electrical properties of n-type Ohmic contact on high-Al-fraction AlGaN

The effects of the radio frequency (RF) bias power of inductively coupled plasma etching on the electrical properties of n-type Ohmic contact have been investigated. By reducing the RF bias power, a high-quality n-type Ohmic contact has been achieved on n-Al0.70Ga0.30N, with a specific contact resistivity of 1.2 × 10−4 Ω cm2. It is confirmed that low-power etching introduces fewer acceptor-state defects on the etched surface, which not only reduces the compensation for electrons but also reduces the degree of oxidation on the etched surface, providing favorable conditions for improving the electrical properties of metal–semiconductor contacts.

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Publication Details

Journal
Applied Physics Letters
Published
2025-02-24
DOI
https://doi.org/10.1063/5.0221287
Citations
3
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
3.77

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article

Effects of the RF bias power of ICP etching on the electrical properties of n-type Ohmic contact on high-Al-fraction AlGaN

L. S. Zhang, Ning Tang, Xinqiang Wang, Chengzhi Ji et al.
3 citations
Applied Physics Letters
GaN-based semiconductor devices and materials
3.77
article

Effects of the RF bias power of ICP etching on the electrical properties of n-type Ohmic contact on high-Al-fraction AlGaN

L. S. Zhang, Ning Tang, Xinqiang Wang, Chengzhi Ji, Jing Lang, Ji Chen, Xuelin Yang, Xiang Guo, Yanqing Wu, Xiangning Kang, Fujun Xu, Zhiyong Zhang, Jiaming Wang, Bo Shen, Weikun Ge, F. Y. Tan
article en
3 citations

Abstract

The effects of the radio frequency (RF) bias power of inductively coupled plasma etching on the electrical properties of n-type Ohmic contact have been investigated. By reducing the RF bias power, a high-quality n-type Ohmic contact has been achieved on n-Al0.70Ga0.30N, with a specific contact resistivity of 1.2 × 10−4 Ω cm2. It is confirmed that low-power etching introduces fewer acceptor-state defects on the etched surface, which not only reduces the compensation for electrons but also reduces the degree of oxidation on the etched surface, providing favorable conditions for improving the electrical properties of metal–semiconductor contacts.

Applied Physics LettersVol. 126(8)
Peking University (CN), Collaborative Innovation Center of Quantum Matter (CN)
National Natural Science Foundation of China, National Key Research and Development Program of China
Openalex Percentile: Top 8%
GaN-based semiconductor devices and materials
3.77
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